Semiconductor chip and semiconductor device

ABSTRACT

A semiconductor device includes a first semiconductor chip operating at a first power supply voltage and a second semiconductor chip operating at a second power supply voltage lower than the first power supply voltage to supply the second power supply voltage to the first semiconductor chip. The semiconductor chips according to the present invention are conveniently used for fabrication of the semiconductor device. The first semiconductor chip includes an output circuit including a first transistor and a second transistor, interconnected in series and turned on or off complementarily. The output circuit outputs a signal to a first external output terminal. The first semiconductor chip also includes a third transistor connected in series with the first and second transistors and having a gate electrode connected to a second output terminal. The entire chip area is reduced, as compared with the case where plural semiconductor chips, operated at different operating voltages, are interconnected and used as such in a semiconductor device provided with an input/output buffer operating at a voltage different from the respective operating voltages resulting in an increased chip area.

FIELD OF THE INVENTION

This invention relates to a semiconductor device and, more particularly,to a semiconductor device including two semiconductor chips. Thisinvention may be applied to advantage especially in case the two chipsof the semiconductor device operate at different operating voltages.

BACKGROUND OF THE INVENTION

It has been practiced in recent years to fabricate a semiconductordevice of high functionality as a plural number of semiconductor chipswith different functions are housed in one and the same package. Thissort of the semiconductor device, termed a multichip package (MCP), isdisclosed in Patent Document 1, for example. The MCP is stirring upnotice in view of its merits that the semiconductor device may befabricated more easily and more inexpensively than an SoC(System-on-Chip) in which a plural number of functions are integrated inone and the same chip.

An example of the MCP is one in which a logic chip and a memory chip arepackaged together. As for the logic chip, its operating voltage has beenlowered appreciably because miniaturization is going on at a rapid pacefor achieving high performance and low power consumption. On the otherhand, there is an occasion where a memory chip of only a small capacitymay be sufficient for use in the MCP. Thus, the fabrication techniqueseveral generations before may be used for fabricating the memory chipof the small capacity. However, the operating voltage for suchsmall-capacity memory chip may be relatively high from time to time.

In such case, plural semiconductor chips differing in the operatingvoltage may need to be used in combination.

If, when the semiconductor chips, differing in the operating voltage,are used in combination, the semiconductor chip having a higheroperating voltage directly outputs a data signal, the operating voltageof which is HIGH, to the semiconductor chip having a lower operatingvoltage, there is a possibility of destruction of transistorsconstituting an input circuit of the receiving semiconductor chipoperating at the lower operating voltage.

On the other hand, if the semiconductor chip, operating at a lowervoltage, directly transmits a data signal, having the low voltage as aHIGH level signal, to the semiconductor chip operating at a highvoltage, there is a possibility that the logic of an input circuit ofthe semiconductor chip operating at the higher voltage cannot bedetermined as normally.

Heretofore, the above problems have been dealt with in the followingmanner.

That is, the conventional practice in combining a memory chip, operatingat 1.5V, with a logic chip operating at 1.0V, has been to provide a 3.3Vpower supply unit in each of the memory chip and the logic chip, andalso to provide an input/output circuit, operating at 3.3V, within eachof the chips. In short, a buffer circuit for equating the input/outputvoltages between the chips is provided in each of the chips. [PatentDocument 1] J P Patent Kokai Publication No. JP-P2005-217205A

SUMMARY OF THE DISCLOSURE

The present inventor has found that, with the above-described relatedart, in which a buffer circuit operating at a voltage different from theoperating voltage has to be provided in each of the data transmittingside semiconductor chip and the data receiving side semiconductor chip,there is raised a problem that the respective semiconductor chips arenecessarily increased in area.

For example, if a memory chip is to output a data signal with a datawidth of 16 bits, it is necessary to provide 16 buffer circuits, eachoperating at a voltage differing from the operating voltage, and hence aserious problem is raised in connection with the increasing chip area.

Meanwhile, the ‘operating voltage’ herein means a voltage used indriving the internal circuitry. The internal circuitry means a circuitfor executing processing operations insofar as the logic chip isconcerned, and means a memory cell circuit, an X-decoder, a Y-decoderand a sense amplifier insofar as the memory chip is concerned.

According to the present invention, the operating voltage of one of thesemiconductor chips is supplied therefrom to the other semiconductorchip.

By this feature, the other semiconductor chip is able to generate a datasignal of the one semiconductor chip the operating voltage of which isat the HIGH level. Thus, at least the one semiconductor chip is able toreceive the data signal, the HIGH level of which is the own operatingvoltage, from the other semiconductor chip. Consequently, there is nonecessity of separately providing a buffer circuit operating at avoltage different from the own operating voltage.

According to a first aspect of the present invention, for example, thereis provided a semiconductor device including a first semiconductor chipoperating at a first power supply voltage, and a second semiconductorchip operating at a second power supply voltage lower than said firstpower supply voltage. The second semiconductor chip supplies the secondpower supply voltage to the first semiconductor chip.

The first semiconductor chip may include: an output circuit that outputsa signal to the second semiconductor chip; and a voltage supplyingcircuit that receives the second power supply voltage from the secondsemiconductor chip and supplies the second power supply voltage to theoutput circuit.

The voltage supplying circuit may receive the first power supply voltageand outputs the second power supply voltage.

It is preferred that the voltage supplying circuit is a MOSFET connectedbetween a power supply line supplying the first power supply voltage andthe output circuit; and the second power supply voltage is supplied asinput to the gate of the MOSFET.

Preferably, the output circuit includes first and second transistorsturned on or off complementarily; and the voltage supplying circuit isconnected between the first and second transistors.

The voltage supplying circuit may be a MOSFET having a gate suppliedwith the second power supply voltage.

The semiconductor device may further comprise: an external terminalelectrically interconnecting the first and second semiconductor chips;and the voltage supplying circuit may comprise a line interconnectingthe output circuit and the external terminal.

The output circuit may include first and second transistors turned on oroff complementarily; and the second power supply voltage may be suppliedto the source or drain of the first transistor.

The first semiconductor chip may include: an input circuit operating attwo power supply voltages, that is, the first power supply voltage, andthe second power supply voltage that is supplied from the secondsemiconductor chip.

The output circuit and the input circuit may transmit and receivesignals to and from the second semiconductor chip over the same externalterminal.

According to a second aspect of the present invention, there is alsoprovided a semiconductor chip conveniently used in the semiconductordevice. The semiconductor chip includes an output circuit including afirst transistor and a second transistor, being interconnected in seriesand turned on or off complementarily. The output circuit outputs asignal to a first external output terminal. The semiconductor chip alsoincludes a third transistor connected in series with the first andsecond transistors and having a gate terminal connected to a secondexternal output terminal.

In the second aspect, i.e., in the semiconductor chip, the thirdtransistor may be connected between the first and second transistors.

The semiconductor chip may further comprise: a first power supplyvoltage supply source; the third transistor being connected between thefirst power supply voltage supply source and the first transistor.

The semiconductor chip may further comprise: a first power supplyvoltage supply source; and an internal circuit outputting a signal tothe output circuit; the first transistor having one terminal connectedto the first power supply voltage supply source; the internal circuitoperating by a voltage supplied from the first power supply voltagesupply source.

The semiconductor chip may further comprise: an internal circuitoperating by a voltage supplied from the first power supply voltagesupply source; the internal circuit outputting a signal to the outputcircuit.

In the semiconductor chip, the third transistor may output a voltage,applied to a gate electrode thereof, at one terminal thereof.

The threshold value of the third transistor may be substantially 0V.

The semiconductor chip may further comprise: an input circuit having aninput terminal connected to the first external terminal; the inputcircuit being driven by two voltages, namely a voltage supplied by thefirst power supply voltage supply source and a voltage entered to thesecond external terminal.

The first and second transistors may constitute a tristate buffer.

The voltage applied to the second external terminal may be lower thanthe voltage supplied from the first power supply voltage supply source.

The meritorious effects of the present invention are summarized asfollows.

According to the present invention, since there is no necessity forproviding a buffer circuit or circuits operating at a voltage orvoltages different from the operating voltage, the semiconductor chip,and thus the semiconductor device, may be reduced in size.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram for illustrating a preferred mode for carrying outthe present invention.

FIG. 2 is a diagram for illustrating a first example of the presentinvention.

FIG. 3 is a diagram for illustrating a second example of the presentinvention.

FIG. 4 is a diagram for illustrating a third example of the presentinvention.

FIGS. 5A and 5B are diagrams for comparing the first and third examplesof the present invention.

PREFERRED MODES FOR CARRYING OUT THE INVENTION

An example of the present invention will now be described with referenceto FIG. 1.

FIG. 1 schematically shows a semiconductor device 100 according to afirst example of the present invention.

The semiconductor device 100 includes a first semiconductor chip 10 anda second semiconductor chip 20. In the following, the present firstexample will be described with the first semiconductor chip 10 being amemory chip (first sort of chip) and with the second semiconductor chip20 being a logic chip (second sort of chip). However, the presentinvention is not to be limited to these particular sorts of thesemiconductor chips.

The memory chip 10 includes an internal circuit 12 including e.g.,memory cells, decoders and sense amplifiers, not shown. The internalcircuit 12 is connected to a power supply line Vdd1, as a first powersupply voltage supply source, and outputs a data signal SD1, the HIGHlevel of which is the first power supply voltage supplied by the powersupply line Vdd1. That is, the internal circuit 12 has the first powersupply voltage, supplied by the power supply line Vdd1, as an operatingvoltage. In the following explanation of the present example, the firstpower supply voltage is assumed to be 1.5V.

Meanwhile, the power supply line, denoted by the same reference numeral,herein means an interconnection (wiring) on which the same power supplyvoltage is transmitted. The interconnection may be one and the same lineor may also be separate lines, provided that there is supplied the samepower supply voltage on these lines.

The memory chip 10 includes an output circuit 14. The output circuit 14receives a data signal SD1, output by the internal circuit 12, as itsinput, and outputs a data signal SD2 to a bump B1 as a first outputterminal.

The memory chip 10 also includes a power supply voltage supplyingcircuit 16. The power supply voltage supplying circuit 16 receives, asinput, a voltage signal SV, supplied to a bump B2, as a second externalterminal, and transmits a voltage, which is the same as the voltage ofthe voltage signal SV, to the output circuit 14. This output circuitoutputs a data signal SD2, the HIGH level of which is the voltagesupplied from the power supply voltage supplying circuit 16, to the bumpB1.

The logic chip 20 includes an internal circuit 22 configured so as toexecute processing operations. The internal circuit 22 is connected to apower supply line Vdd2, as a second power supply voltage supply source,and has a second power supply voltage, supplied by the power supply lineVdd2, as its operating voltage. The second power supply voltage is lowerthan the first power supply voltage. In the present example, the secondpower supply voltage is assumed to be 1.0V.

The logic chip 20 also includes an input circuit 28 having a secondpower supply voltage (Vdd2) as its operating voltage. The input circuit28 has the data signal SD2, transmitted thereto from the memory chip 10via bump B3, as a third external terminal, and outputs a data signalSD3, the HIGH level of which is the second power supply voltage, to theinternal circuit 22. It is noted that, when the memory chip 10 and thelogic chip 20 are interconnected by flipchip connection, the bumps 1 and2 denote the same bump.

The logic chip 20 also includes a bump B4 as a fourth external terminal.The bump B4 is connected to the power supply line Vdd2, while beingelectrically connected to the bump B2 of the memory chip 10. That is,the logic chip 20 supplies the second power supply voltage to the memorychip 10 via bumps B4 and B2. Specifically, the logic chip 20 transmitsthe second power supply voltage to the power supply voltage supplyingcircuit 16 of the memory chip 10.

The operation of the memory chip 10 will now be described in associationoperatively with the logic chip 20.

Initially, the power supply voltage supplying circuit 16 receives thevoltage of 1.0V from the logic chip 20, via bumps B2, B4, to output 1.0Vto the output circuit 14.

On the other hand, the internal circuit 12 of the memory chip 10receives the voltage of 1.5V from the power supply line Vdd1, to outputthe data signal SD1, the HIGH level of which is 1.5V, to the outputcircuit 14.

The output circuit 14 receives the power supply voltage of 1.0V from thepower supply voltage supplying circuit 16, and outputs the data signalSD2, the HIGH level of which is 1.0V, to the logic chip 20, based on thedata signal SD1 entered from the internal circuit 12.

The input circuit 28 of the logic chip 20 receives the data signal SD2,as input, from the memory chip 10. At this time, the HIGH level of thedata signal SD2 is 1.0V which is the operating voltage of the logic chip20 itself. Hence, there is no risk of malfunctions or transistordestruction even if the data signal is received by e.g., an inverteroperating at 1.0V. Consequently, there is no necessity for providing aninput buffer circuit, operating at a voltage different from theoperating voltage of the logic chip 20, such as 3.3V, in the logic chip20, with the result that the chip may be reduced in size.

FIG. 2 shows a semiconductor device 200 according to the first exampleof the present invention. In FIG. 2, the same parts or components asthose of FIG. 1 are denoted by the same reference numerals, anddescription therefor is omitted from time to time.

The output circuit 14 of the memory chip 10 includes a pair oftransistors Tr1, Tr2 turned on or off complementarily. In the instantexample, the transistors Tr1, Tr2 are assumed to be a PMOS transistorand an NMOS transistor, respectively.

In the output circuit 14, a tri-state buffer circuit is constituted bythe transistors Tr1, Tr2, a NAND 142, a NOR 144 and an inverter 146.Meanwhile, the output circuit 14 may be constituted not by the tri-statebuffer circuit but by an inverter formed by the transistors Tr1, Tr2.

A power supply voltage supplying circuit 16 comprises an NMOS transistorTr3. This NMOS transistor Tr3 is connected in series between the PMOStransistor Tr1 and the NMOS transistor Tr2. To the gate electrode of theNMOS transistor Tr3 is applied 1.0V, as the power supply voltage of thelogic chip 20, via bump B2.

A node N1, as a junction point between the source terminal of the NMOStransistor Tr3 and the drain terminal of the NMOS transistor Tr2, is anoutput terminal of the output circuit 14, and is connected to the bumpB1.

In a channel region of the NMOS transistor Tr3, no impurity is doped,such that its on-voltage is substantially 0V. Hence, the NMOS transistorTr3 operates as a circuit which clamps the voltage applied to its drainterminal and which outputs the voltage applied to its gate electrode toits source terminal.

The transistors Tr1, Tr2 and Tr3 will be described in further detail.The back gate of the PMOS transistor Tr1 is connected to the powersupply line Vdd1 and biased at 1.5V. The back gates of the NMOStransistors Tr2, Tr3 are connected to the ground GND1 and biased to theground potential.

The operation of the output circuit 14 will now be described.

When a mode selection signal SM1 of the HIGH level (1.5V) is enteredfrom the internal circuit 12 to a mode selection terminal MT of theoutput circuit 14, the output circuit 14 enters into an output mode. Theoutput circuit 16 outputs, at the node N1, the data signal SD2, whichbecomes HIGH or LOW responsive to the data signal SD1 transmitted to adata terminal DT as input signal. The data signal SD2 is transmitted viabumps B1, B3 to the input circuit 28 of the logic chip 20.

When the mode selection signal SM1 becomes LOW, the output of the NAND142 becomes HIGH, while the output of the NOR 144 becomes LOW, withoutdependency upon the logic entered to the data terminal DT. Hence, thePMOS transistor Tr1 and the NMOS transistor Tr2 are both turned off,with the node N1 being of high impedance. In this state, the memory chip10 receives the data signal by the input circuit 18 via bump B1.

More specifically, if the output circuit 14 is in the output mode, andthe HIGH level has been entered to the data terminal DT, the outputs ofthe NAND 142 and the NOR 144 become LOW in level. Hence, the PMOStransistor Tr1 and the NMOS transistor Tr2 are turned on and off,respectively.

Hence, the voltage of 1.5V, which is the operating voltage of the memorychip 10, is applied from the power supply line Vdd1 to the drainterminal of the NMOS transistor Tr3 via PMOS transistor Tr1.

It is noted that the voltage of 1.0V, is supplied from the logic chip 20to the gate electrode of the NMOS transistor Tr3 via bump B2. Hence, thevoltage of 1.0V, is output to the source terminal of the NMOS transistorTr3, that is, to the node N1. Consequently, the output circuit 14 isable to output a data signal, having the HIGH level of 1.0V, which isthe operating voltage of the logic chip 20.

On the other hand, if the LOW level is applied to the data terminal DTunder the output mode, the outputs of the NAND 142 and the NOR 144 bothbecome HIGH in level, so that the PMOS transistor Tr1 and the NMOStransistor Tr2 are turned off and on, respectively. Thus, the groundvoltage is applied to the node N1 via NMOS transistor Tr2, and hence theoutput circuit 14 outputs the LOW level.

As may be seen from the above description of the present example, thesemiconductor chip (memory chip 10), supplied from the othersemiconductor chip (logic chip 20) with the power supply voltage (1.0V)of the other semiconductor chip, may also be reduced in chip area. Thereason may be summarized as follows: Heretofore, an output of aninternal circuit is again received by an output buffer circuit,operating at 3.3V, different from the chip's own operating voltage, andsubsequently output to outside the chip. Since a well for forming anoutput buffer circuit operating with the voltage of 3.3V and anotherwell for forming an internal circuit operating with the voltage of 1.5Vneed to be electrically isolated from each other, those wells need to beprovided separately. Additionally, for electrically isolating the wellsfrom each other, it is necessary to provide a device isolation area,such as STI, of a larger size, and to provide some sizeable distancebetween the two wells. The result is an increased area of thesemiconductor chip. With the present example, the NMOS transistor Tr3,as a power supply voltage supplying circuit, is provided in an outputbuffer circuit (output circuit 14 in the present example) operating at1.5V, so that it is unnecessary to provide a separate output buffercircuit operating at 3.3V. The output buffer circuit, operating at 1.5V,may be formed in the well in which to form the internal circuit is to beformed. Even supposing that the well for the output buffer operating at1.5V be provided independently, it does not have to be separated so farfrom the well in which the internal circuit is to be formed. Thus, withthe present invention, the semiconductor chip may be reduced in the chiparea as compared to the technique of the related art.

The case in which the memory chip 10 receives the data signal from thelogic chip 20 will now be described.

The internal circuit 22 of the logic chip 20 is connected to the powersupply line Vdd2 and is in operation at 1.0V, to output the data signalSD3 having the HIGH level of 1.0V, to an output circuit 24.

The output circuit 24 of the logic chip 20 is connected to the powersupply line Vdd2 and is in operation at 1.0V to output a data signalSD4, having the HIGH level of 1.0V, responsive to the data signal SD3entered from the internal circuit 22.

The data signal SD4, output from the output circuit 24 of the logic chip20, is entered via bumps B3, B1 to the input circuit 18 of the memorychip 10. That is, the bumps B1 and B3 are external terminals used forboth inputting and outputting simultaneously.

The input circuit 18 of the memory chip 10 is made up of a flipflopcircuit 182 and an inverter 184. The flipflop circuit is composed ofPMOS transistors Tr4, Tr6 and NMOS transistors Tr5, Tr7. The inputcircuit 18 outputs a voltage at a node N2 between the PMOS transistorTr6 and the NMOS transistor Tr7 as a data signal SD5 to the internalcircuit 12.

The flipflop circuit 182 operates at 1.5V to output the data signal SD5,the HIGH level of which is 1.5V. On the other hand, the inverter 184receives the voltage from the bump B2 so as to be operated at 1.0V, tooutput a signal SD6, the HIGH level of which is 1.0V, to the NMOStransistor Tr7.

The operation of the input circuit 18 is such that, when the data signalSD4, transmitted to the bump B1, is HIGH in level, the circuit outputs1.5V, as HIGH level, to the node N2. When the data signal SD4 is LOW inlevel, the circuit outputs the LOW level to the node N2.

Since the input circuit 18 of the memory chip 10 is constructed asdescribed above, the signal SD4, the HIGH level of which is 1.0V, may beconverted into a signal, the HIGH level of which is 1.5V, withoutgenerating the static flowing-through current.

A semiconductor device 300, according to a second example of the presentinvention, will now be described with reference to FIG. 3.

The present example differs from the first example as to the point ofconnection of the NMOS transistor Tr3 operating as the power supplyvoltage supplying circuit 16. In the present example, the NMOStransistor Tr3 is connected between the power supply line Vdd1 and thePMOS transistor Tr1. With this constitution, 1.5V is applied to thedrain terminal of the NMOS transistor Tr3, the source terminal of whichoutputs 1.0V, which is the voltage applied to its gate terminal.

That is, the output circuit 14 receives 1.0V, from the NMOS transistorTr3 to output the data signal SD2 having the HIGH level of 1.0V.

The present example is otherwise the same as the first example describedabove.

A semiconductor device 400, according to a third example of the presentinvention, will now be described with reference to FIG. 4.

In the present example, the source terminal of the PMOS transistor Tr1of the output circuit 14 is directly connected over a line 162 to thebump B2. That is, the line 162 operates as the power supply voltagesupplying circuit 16.

With the above constitution, the output circuit 14 is supplied with1.0V, from the logic chip 20 over bump B2 and line 162, to output thedata signal SD2, the HIGH level of which is 1.0V.

(Contrasting the First and Third Examples)

The third example has an advantage over the first example that there isno necessity of providing the NMOS transistor Tr3 and hence the thirdexample may be simplified in constitution. On the other hand, the firstexample has an advantage over the third example that it may be reducedin circuit area. The reason for the above will now be described withreference to FIG. 5.

FIG. 5A depicts a partial cross-sectional view of a semiconductor device400 according to the third example of the present invention. Referringto the circuit diagram of FIG. 4, the PMOS transistor Tr1, constitutingthe output circuit 14, has a back gate connected to the bump B2 so as tobe thereby biased to 1.0V. On the other hand, a PMOS transistor Tr12,constituting the NAND 142 or the NOR 144, has a back gate biased to1.5V.

Thus, an N-well Nw1, in the inside of which is formed the PMOStransistor Tr1, and an N-well Nw2, in the inside of which is formed thePMOS transistor Tr12, constituting the NAND 142 or the NOR 144, need tobe electrically isolated from each other, as shown in FIG. 5A. However,if the N-wells Nw1 and Nw2, differing in potential from each other, areto be isolated from each other, it would be necessary to provide STI(Shallow Trench Isolation) 30, for example.

FIG. 5B depicts a partial cross-sectional view of the semiconductordevice 200 according to the first example of the present invention.

Referring to the circuit diagram of FIG. 2, the back gate of the PMOStransistor Tr1 is connected to the power supply line Vdd1 so as to bebiased to 1.5V. Consequently, the PMOS transistor Tr12, constituting theNAND 142 or the NOR 144, for example, and the PMOS transistor Tr1, maybe formed in one and the same N-well Nw3, as shown in FIG. 5B, so thatit is unnecessary to provide the STI in order to electrically isolatethe N-wells, having the differential potential, from each other (referto FIG. 5A).

With the output circuit 14 of the first example, it is necessary toprovide one more NMOS transistor, namely the NMOS transistor Tr3, ascompared to the output circuit of the third example. In general, a MOStransistor takes up a smaller space than in the case of STI used forisolating the N-wells Nw1 and Nw2 having different potentials. Thus,with the semiconductor device of the first example, the circuit area maybe smaller than that of the semiconductor device of the third example.

It is to be noted that the present invention is not limited to theabove-described examples, and may optionally be modified withoutdeparting from the spirit and scope of the invention.

It should be noted that other objects, features and aspects of thepresent invention will become apparent in the entire disclosure and thatmodifications may be done without departing the gist and scope of thepresent invention as disclosed herein and claimed as appended herewith.

Also it should be noted that any combination of the disclosed and/orclaimed elements, matters and/or items may fall under the modificationsaforementioned.

1. A semiconductor chip comprising: an output circuit including a firsttransistor and a second transistor, being interconnected in series andturned on or off complementarily, said output circuit outputting asignal to a first external terminal; and a third transistor connected inseries with said first and second transistors and having a gate terminalconnected to a second external terminal.
 2. The semiconductor chipaccording to claim 1 wherein said third transistor is connected betweensaid first and second transistors.
 3. The semiconductor chip accordingto claim 1 further comprising: a first power supply voltage supplysource; said third transistor being connected between said first powersupply voltage supply source and said first transistor.
 4. Thesemiconductor chip according to claim 2 further comprising: a firstpower supply voltage supply source; and an internal circuit outputting asignal to said output circuit; said first transistor having one terminalconnected to said first power supply voltage supply source; saidinternal circuit operating by a voltage supplied from said first powersupply voltage supply source.
 5. The semiconductor chip according toclaim 3 further comprising: an internal circuit operating by a voltagesupplied from said first power supply voltage supply source; saidinternal circuit outputting a signal to said output circuit.
 6. Thesemiconductor chip according to claim 1 wherein said third transistoroutputs a voltage, applied to a gate electrode thereof, at one terminalthereof.
 7. The semiconductor chip according to claim 6 wherein thethreshold value of said third transistor is substantially 0V.
 8. Thesemiconductor chip according to claim 3 further comprising: an inputcircuit having an input terminal connected to said first externalterminal; said input circuit being driven by two voltages, namely avoltage supplied by said first power supply voltage supply source and avoltage entered to said second external terminal.
 9. The semiconductorchip according to claim 1 wherein said first and second transistorsconstitute a tristate buffer.
 10. The semiconductor chip according toclaim 3 wherein the voltage applied to said second external terminal islower than the voltage supplied from said first power supply voltagesupply source.
 11. A semiconductor device comprising: a firstsemiconductor chip operating at a first power supply voltage; and asecond semiconductor chip operating at a second power supply voltagelower than said first power supply voltage; said second semiconductorchip supplying said second power supply voltage to said firstsemiconductor chip.
 12. The semiconductor device according to claim 11wherein said first semiconductor chip includes: an output circuit thatoutputs a signal to said second semiconductor chip; and a voltagesupplying circuit that receives said second power supply voltage fromsaid second semiconductor chip and supplies said second power supplyvoltage to said output circuit.
 13. The semiconductor device accordingto claim 12 wherein said voltage supplying circuit receives said firstpower supply voltage and outputs said second power supply voltage. 14.The semiconductor device according to claim 13 wherein said voltagesupplying circuit is a MOSFET connected between a power supply linesupplying said first power supply voltage and said output circuit; andsaid second power supply voltage is supplied as input to the gate ofsaid MOSFET.
 15. The semiconductor device according to claim 13 whereinsaid output circuit includes first and second transistors turned on oroff complementarily; and said voltage supplying circuit is connectedbetween said first and second transistors.
 16. The semiconductor deviceaccording to claim 15 wherein said voltage supplying circuit is a MOSFEThaving a gate supplied with said second power supply voltage.
 17. Thesemiconductor device according to claim 12 further comprising: anexternal terminal electrically interconnecting said first and secondsemiconductor chips; and said voltage supplying circuit comprises a lineinterconnecting said output circuit and said external terminal.
 18. Thesemiconductor device according to claim 17 wherein said output circuitincludes first and second transistors turned on or off complementarily;and said second power supply voltage is supplied to the source or drainof said first transistor.
 19. The semiconductor device according toclaim 12 wherein said first semiconductor chip includes: an inputcircuit operating at two power supply voltages, that is, said firstpower supply voltage, and said second power supply voltage that issupplied from said second semiconductor chip.
 20. The semiconductordevice according to claim 19 wherein said output circuit and said inputcircuit transmit and receive signals to and from said secondsemiconductor chip over the same external terminal.